Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials (US5724729)


	Parent Case:			CROSS-REFERENCE This patent application is a Continuation of U.S. patent application Ser. No. 08/455,463, filed on May 31, 1995, now U.S. Pat. No. 5,604,978, which was a Division of U.S. patent application Ser. No. 08/349,232, filed on Dec. 5, 1994.
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	First Claim: Show all 18 claims			What is claimed is: 1. A method to provide a customized thermally conductive path between a plurality of chips and a thermal cap, comprising the steps of: (a) securing said chips to a substrate, (b) placing at least one first thermally conductive material on a first chip, and at least one second thermally conductive material on a second chip, wherein the thermal conductivity of said first thermally conductive material is different than the thermal conductivity of said second thermally conductive material, and wherein said at least one first thermally conductive material is selected from a group consisting of thermal oil, thermal paste, thermal grease and thermal compound, and (c) securing said thermal cap to said substrate.
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	Forward References:			Show 41 U.S. patent(s) that reference this one

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