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Title: US6154363: Electronic device cooling arrangement
[ Derwent Title ]


Country: US United States of America

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7 pages

 
Inventor: Chang, Neng Chao; Tu Cheng City, Taipei Hsien, Taiwan

Assignee: None

Published / Filed: 2000-11-28 / 1999-12-29

Application Number: US1999000474252

IPC Code: Advanced: H01L 23/40; H01L 23/473;
Core: H01L 23/34;
IPC-7: H05K 7/20;

ECLA Code: H01L23/40S; H01L23/473;

U.S. Class: Current: 361/699; 165/080.4; 174/015.1; 257/714; 257/E23.086; 257/E23.098; 361/689; 361/702;
Original: 361/699; 361/689; 361/702; 257/714; 174/015.1; 165/080.4;

Field of Search: 361/689,690,694,698,699,701,702,703,707,711 257/714-716,721 174/15.1 165/80.4

Priority Number:
1999-12-29  US1999000474252

Abstract:     An electronic device cooling arrangement, which includes a flat, rectangular metal water container attached to an electronic device, for example, a CPU for carrying heat away from the CPU, the metal water container having a thinner middle portion for causing a venturi effect upon flowing of water through the metal water container, a first plug installed in one thicker lateral portion of the metal water container for guiding a flow of cooling water from an external water source into the metal water container, and a second plug installed in an opposite thicker lateral portion of the metal water container remote from the first plug for guiding the intake flow of cooling water out of the metal water container for enabling heat to be carried away from the CPU with the output flow of cooling water.

Attorney, Agent or Firm: Rosenberg, Klein & Lee ;

Primary / Asst. Examiners: Picard, Lee P.; Chervinsky, Boris L.

Maintenance Status: E1 Expired  Check current status

INPADOC Legal Status: Show legal status actions

Family: None

First Claim:
Show all 5 claims
What the invention claimed is:     1. An electronic device cooling arrangement comprising:
  • a flat, rectangular metal water container attached to an electronic device for carrying heat away from the electronic device, said metal water container having a thinner middle portion and two thicker lateral portions at two opposite lateral sides of said thinner middle portion;
  • a first plug installed in one thicker lateral portion of said metal water container for guiding a flow of cooling water into said metal water container; and
  • a second plug installed in one thicker lateral portion of said metal water container remote from said first plug for guiding intake flow of cooling water out of said metal water container.


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Forward References: Show 29 U.S. patent(s) that reference this one

       
U.S. References: Go to Result Set: All U.S. references   |  Forward references (29)   |   Backward references (9)   |   Citation Link

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PDF
Patent  Pub.Date  Inventor Assignee   Title
Buy PDF- 5pp US3481393  1969-12 Chu   MODULAR COOLING SYSTEM
Buy PDF- 10pp US4072188  1978-02 Wilson et al.  Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
Buy PDF- 13pp US5089936  1992-02 Kojima et al.  Hitachi, Ltd. Semiconductor module
Buy PDF- 8pp US5249100  1993-09 Satoh et al.  Hitachi, Ltd. Electronic circuit device provided with a ceramic substrate having lead pins bonded thereto by solder
Buy PDF- 10pp US5365402  1994-11 Hatada et al.  Hitachi, Ltd. Cooling apparatus of electronic device
Buy PDF- 10pp US5457342  1995-10 Herbst, II   Integrated circuit cooling apparatus
Buy PDF- 8pp US5640303  1997-06 Hooley  Precision Connector Designs, Inc. Interconnection apparatus for semiconductor/integrated circuit devices
Buy PDF- 8pp US5731954  1998-03 Cheon   Cooling system for computer
Buy PDF- 7pp US5870823  1999-02 Bezama et al.  International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
       
Foreign References:
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PDF
Publication Date IPC Code Assignee   Title
  JP1991403159160A 1991-07       


Other Abstract Info: DERABS G2001-090066 DERABS G2001-090066

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