Work Files Saved Searches
   My Account                                                  Search:   Quick/Number   Boolean   Advanced   Derwent    Help   


 The Delphion Integrated View

  Buy Now:   Buy PDF- 9pp  PDF  |   File History  |   Other choices   
  Tools:  Citation Link  |  Add to Work File:    
  View:  Expand Details   |  INPADOC   |  Jump to: 
  Go to:  Derwent  
 Email this to a friend  Email this to a friend 
       
Title: US6905736: Fabrication of nano-scale temperature sensors and heaters
[ Derwent Title ]


Country: US United States of America

View Images High
Resolution

 Low
 Resolution

 
9 pages

 
Inventor: Chow, Lee; Orlando, FL, United States of America
Zhou, Dan; Orlando, FL, United States of America
Stevie, Fred; Raleigh, NC, United States of America

Assignee: University of Central Florida, Orlando, FL, United States of America
other patents from UNIVERSITY OF CENTRAL FLORIDA (599435) (approx. 135)
 News, Profiles, Stocks and More about this company

Published / Filed: 2005-06-14 / 2002-02-27

Application Number: US2002000084688

IPC Code: Advanced: B05D 5/12; C23C 14/14; C23C 14/16; C23C 16/04; C23C 16/16; C23C 16/48; G01K 7/02;
Core: more...
IPC-7: B05D 5/12; C23C 14/14; C23C 14/16;

ECLA Code: C23C16/16; C23C16/04F; C23C16/48L; G01K7/02M; Y01N8/00;

U.S. Class: Current: 427/564; 374/E07.008; 427/123; 427/125; 427/531; 427/595;
Original: 427/564; 427/531; 427/595; 427/096; 427/123; 427/125;

Field of Search: 427/526,531,562,564,595,77,96,123,125 438/584,622,650,652,666,674,685,686,688

Priority Number:
2002-02-27  US2002000084688
2001-02-28  US2001000272155P

Abstract:     The method for the fabrication of nano scale temperature sensors and nano scale heaters using focused ion beam (FIB) techniques. The process used to deposit metal nano strips to form a sensor is ion beam assisted chemical vapor deposition (CVD). The FIB Ga<SUP>+</SUP> ion beam can be used to decompose W(CO)<SUB>6 </SUB>molecules to deposit a tungsten nano-strip on a suitable substrate. The same substrate can also be used for Pt nano-strip deposition. The precursors for the Pt can be trimethyl platinum (CH<SUB>3</SUB>)<SUB>3</SUB>Pt in the present case. Because of the Ga<SUP>+</SUP> beam used in the deposition, both Pt and W nano-strips can contain a certain percentage of Ga impurities, which we denoted as Pt(Ga) and W(Ga) respectively. Our characterization of the response of this Pt(Ga)/W(Ga) nano scale junction indicates it has a temperature coefficient of approximately 5.4 mV/° C. This is a factor of approximately 130 larger than the conventional K-type thermocouples.

Attorney, Agent or Firm: Steinberger, Brian S. ; Law Offices of Brian S. Steinberger P.A. ;

Primary / Asst. Examiners: Padgett, Marianne;

INPADOC Legal Status: Show legal status actions          Buy Now: Family Legal Status Report

Family: Show 2 known family members

First Claim:
Show all 12 claims
    1. A method of making a nano sized sensor comprising the steps of:

(a) depositing a first metal nano sized strip on an electrical insulator substrate by a FIB (Focused Ion Beam) deposition process;

(b) depositing a second metal nano sized strip on the same said substrate by said FIB process in a partially overlapping portion on said first metal nano sized strip, the second metal nano sized strip being formed of a different metal material from the first metal nano sized strip, the partially overlapping portion being selected from one of a ball-shaped portion, and a point shaped configuration portion, wherein the first metal nano sized strip and the second metal nano sized strip each include a thickness of approximately 50 nm; and

(c) forming a bi-metal sensing junction from the partially overlapping portion between the first metal nano sized strip and the second metal nano sized strip, wherein the bi-metal sensing junction includes a cross-sectional area of approximately 50×50 nm2 and the junction is selected from one of a ball-shaped portion, and a point shaped configuration portion.



Background / Summary: Show background / summary

Drawing Descriptions: Show drawing descriptions

Description: Show description

Forward References: Show 1 U.S. patent(s) that reference this one

       
U.S. References: Go to Result Set: All U.S. references   |  Forward references (1)   |   Backward references (11)   |   Citation Link

Buy
PDF
Patent  Pub.Date  Inventor Assignee   Title
Buy PDF- 7pp US4526624  1985-07 Tombrello et al.  California Institute of Technology Enhanced adhesion of films to semiconductors or metals by high energy bombardment
Buy PDF- 25pp US4853341  1989-08 Nishioka et al.  Mitsubishi Denki Kabushiki Kaisha Process for forming electrodes for semiconductor devices using focused ion beams
Buy PDF- 10pp US4908226  1990-03 Kubena et al.  Hughes Aircraft Company Selective area nucleation and growth method for metal chemical vapor deposition using focused ion beams
Buy PDF- 10pp US5104684  1992-04 Tao et al.  Massachusetts Institute of Technology Ion beam induced deposition of metals
Buy PDF- 7pp US5510098  1996-04 Chow  University of Central Florida CVD method of producing and doping fullerenes
Buy PDF- 12pp US5581083  1996-12 Majumdar  The Regents of the University of California Method for fabricating a sensor on a probe tip used for atomic force microscopy and the like
Buy PDF- 16pp US5741557  1998-04 Corbin et al.  International Business Machines Corporation Method for depositing metal fine lines on a substrate
Buy PDF- 15pp US5838005  1998-11 Majumdar et al.  The Regents of the University of California Use of focused ion and electron beams for fabricating a sensor on a probe tip used for scanning multiprobe microscopy and the like
Buy PDF- 11pp US6630395  2003-10 Kane et al.  International Business Machines Corporation Methods for fabricating electrical connections to semiconductor structures incorporating low-k dielectric materials
Buy PDF- 9pp US6638580  2003-10 Gavish  Intel Corporation Apparatus and a method for forming an alloy layer over a substrate using an ion beam
Buy PDF- 10pp US20020086526A1  2002-07 Gavish   APPARATUS AND A METHOD FOR FORMING AN ALLOY LAYER OVER A SUBSTRATE
       
Foreign References:
Buy
PDF
Publication Date IPC Code Assignee   Title
Buy PDF JP2000205969A2 2000-07  G01K 7/02 CANON INC THERMOCOUPLE ELEMENT AND ITS MANUFACTURE 


Other Abstract Info: DERABS C2005-475265

Continuity Data:
Application Number Filed Notes

US2004000764242   is a division of
>US2002000084688<  2002-02-27
     US6905736 issued 2005-06-14   Fabrication of nano-scale temperature sensors and heaters

US2002000084688 2002-02-27  is a non-provisional of provisional
US2001000272155P  2001-02-28


Inquire Regarding Licensing

Powered by Verity


Plaques from Patent Awards      Gallery of Obscure PatentsNominate this for the Gallery...

Thomson Reuters Copyright © 1997-2010 Thomson Reuters 
Subscriptions  |  Web Seminars  |  Privacy  |  Terms & Conditions  |  Site Map  |  Contact Us  |  Help