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Title: US6051113: Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure using target indexing
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Country: US United States of America

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21 pages

 
Inventor: Moslehi, Mehrdad M.; Los Altos, CA

Assignee: CVC Products, Inc., Rochester, NY
other patents from CVC PRODUCTS, INC. (695388) (approx. 41)
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Published / Filed: 2000-04-18 / 1998-05-20

Application Number: US1998000082043

IPC Code: Advanced: C23C 14/56;
Core: more...
IPC-7: C23C 14/34;

ECLA Code: C23C14/56F;

U.S. Class: Current: 204/192.12; 118/719; 118/723.VE; 204/192.11; 204/192.15; 204/192.2; 204/298.03; 204/298.04; 204/298.07; 204/298.08; 204/298.09; 204/298.11; 204/298.12; 204/298.15; 204/298.23; 204/298.25; 204/298.26; 204/298.27; 204/298.28; 204/298.29;
Original: 204/192.12; 204/192.15; 204/192.2; 204/298.03; 204/298.04; 204/298.07; 204/298.08; 204/298.09; 204/298.12; 204/298.11; 204/298.15; 204/298.23; 204/298.25; 204/298.26; 204/298.27; 204/298.28; 204/298.29; 204/192.11; 118/719; 118/723.VE;

Field of Search: 204/192.12,192.2,192.15,298.03,298.04,298.07,298.08,298.09,298.11,298.15,298.23,298.25,298.26,298.27,298.28,298.29,298.12,298.16,192.11 118/719,723 R,723 VE

Priority Number:
1998-05-20  US1998000082043

Abstract: An apparatus and method for depositing plural layers of materials on a substrate within a single vacuum chamber allows high-throughput deposition of structures such as those for GMR and MRAM application. An indexing mechanism aligns a substrate with each of plural targets according to the sequence of the layers in the structure. Each target deposits material using a static physical-vapor deposition technique. A shutter can be interposed between a target and a substrate to block the deposition process for improved deposition control. The shutter can also preclean a target or the substrate and can also be used for mechanical chopping of the deposition process. In alternative embodiments, plural substrates may be aligned sequentially with plural targets to allow simultaneous deposition of plural structures within the single vacuum chamber. A monitoring and control device can be wed to optimize equipment state, process state, and wafer state parameters by sensing each respective state during or after the deposition process. In another alternative embodiment, an additional indexing mechanism can be associated with one or more targets to move the indexing targets positioned on an indexing target plane into a position aligned with the substrate. The indexing target plane is formed within the vacuum chamber and substantially parallel to a fixed target plane in order to reduce the overall PVD equipment footprint for a given number of PVD targets.

Attorney, Agent or Firm: Baker Botts L.L.P. ;

Primary / Asst. Examiners: McDonald, Rodney;

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Related Applications:
Application Number Filed Patent Pub. Date  Title
US1998000067143 1998-04-27       


       
Parent Case:

RELATED APPLICATIONS
    This invention claims priority from U.S. patent Application Ser. No. 09/067,143 entitled pending "Apparatus and Method for Multi-Target Physical-Vapor Deposition of a Multi-Layer Material Structure," filed on Apr. 27, 1998, by Moslehi, et al., assigned to CVC, Inc.

Designated Country: AE AL AM AP AT AZ BA BB BG BR BY CA CH CN CU CZ DK EA EE ES FI GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR  DE GB 

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First Claim:
Show all 75 claims
What is claimed is:     1. An apparatus for physical-vapor deposition of a multi-layer material structure onto a substrate, the material structure having plural material layers deposited according to a predetermined sequence, each layer comprised of one of the plural materials, the apparatus comprising:
  • a vacuum chamber;
  • plural targets comprising at least one indexing target disposed in the vacuum chamber and at least one fixed target disposed in the vacuum chamber, at least one target comprised of one of the plural materials;
  • at least one power source associated with the plural targets for supporting physical-vapor deposition;
  • a substrate support disposed in the vacuum chamber for supporting the substrate; and
  • a target indexing mechanism for aligning the at least one indexing target with the substrate to support deposition of the multi-layer material structure of the plural materials according to the predetermined sequence.


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Forward References: Show 36 U.S. patent(s) that reference this one

       
U.S. References: Go to Result Set: All U.S. references   |  Forward references (36)   |   Backward references (8)   |   Citation Link

Buy
PDF
Patent  Pub.Date  Inventor Assignee   Title
Buy PDF- 6pp US3853740  1974-12 Kunz  Balzer Patent-Und Beteiligungs-Aktiengesellschaft TARGET CHANGER FOR SPUTTERING BY IONIC BOMBARDMENT
Buy PDF- 8pp US4051010  1977-09 Roth et al.  Western Electric Company, Inc. Sputtering apparatus
Buy PDF- 16pp US4410407  1983-10 Macaulay  Raytheon Company Sputtering apparatus and methods
Buy PDF- 7pp US4894132  1990-01 Tanaka  Mitsubishi Denki Kabushiki Kaisha Sputtering method and apparatus
Buy PDF- 9pp US5076205  1991-12 Vowles et al.  General Signal Corporation Modular vapor processor system
Buy PDF- 11pp US5241152  1993-08 Anderson et al.   Circuit for detecting and diverting an electrical arc in a glow discharge apparatus
Buy PDF- 15pp US5490912  1996-02 Warner et al.  The Regents of the University of California Apparatus for laser assisted thin film deposition
Buy PDF- 10pp US5665214  1997-09 Iturralde  Sony Corporation Automatic film deposition control method and system
       
Foreign References:
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PDF
Publication Date IPC Code Assignee   Title
Buy PDF- 13pp GB2228948 1990-09  C23C 14/34 * BRITISH AEROSPACE PUBLIC LIMITED COMPANY FABRICATION OF THIN FILMS FROM A COMPOSITE TARGET 


Other Abstract Info: CHEMABS 131(23)316645D DERABS C1999-634269

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