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Title: USD430145: Acoustic module

Country: US United States of America

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Inventor: Boyden, James H.; Los Altos Hills, CA
Burdick, Wayne; Belmont, CA
Wright, Tricia L.; San Francisco, CA
Herbert, J. Daniell; San Francisco, CA
Gatrall, Simon; San Francisco, CA

Assignee: Interval Research Corp., Palo Alto, CA
other patents from INTERVAL RESEARCH CORPORATION (715526) (approx. 102)
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Published / Filed: 2000-08-29 / 1998-06-24

Application Number: US1998000089896F

IPC Code:
Locarno: 1401;

U.S. Class: Current: D14/223;
Original: D14/223;

Field of Search: D14/124,137,188,192,205,206,223,265 181/129,130,135 379/430,431,444 381/025,68-69,151,183,187

Attorney, Agent or Firm: Artz, John A. ;

Primary / Asst. Examiners: Bondade, Nanda;

Family: None

Claim: The ornamental design for an acoustic module, as shown and described.

Background / Summary: Show background / summary

Drawing Descriptions: Show drawing descriptions

Description: Show description

Forward References: Show 15 U.S. patent(s) that reference this one

       
U.S. References: Go to Result Set: All U.S. references   |  Forward references (15)   |   Backward references (4)   |   Citation Link

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Patent  Pub.Date  Inventor Assignee   Title
Get PDF - 5pp USD326653  1992-06 Hino  Sony Corporation Radio receiver
Get PDF - 3pp USD350961  1994-09 Nakamura  Aiwa Co., Ltd. Earphone
Get PDF - 3pp USD377796  1997-02 Hayashi  Sony Corporation Earphone combined with microphone
Get PDF - 4pp USD388093  1997-12 Frengley  Garwood Communications Limited Pair of ear pieces
       
Foreign References: None

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