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 Title: |
EP1031398A2:
Polishing media stabilizer[German][French]
[ Derwent Title ]
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Country:
Kind: |
EP European Patent Office (EPO)
A2 APPLICATION PUBLISHED WITHOUT SEARCH REPORT i
(See also:
EP1031398A3 )
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| Inventor: |
Sommer, Phillip R.;
Butterfield, Paul D.;
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| Assignee: |
Obsidian, Inc.
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| Published / Filed: |
2000-08-30
/ 2000-02-24
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| Application Number: |
EP2000000301458
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| IPC Code: |
Advanced:
B24B 37/00;
B24B 37/04;
H01L 21/302;
H01L 21/304;
H01L 21/306;
Core:
H01L 21/02;
more...
IPC-7:
B24B 21/04;
B24B 37/04;
H01L 21/306;
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| ECLA Code: |
B24B37/04I2;
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| Priority Number: |
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| Abstract: |
The disclosure relates to a polishing apparatus employing a polishing media (310) retention arrangement to prevent slippage or wrinkles in the polishing media during polishing of a substrate (260). The polishing media is drawn against a support surface (356, 355) by a vacuum (190, 192) applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.
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| Attorney, Agent or Firm: |
Bayliss, Geoffrey Cyril ;
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| INPADOC Legal Status: |
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Family Legal Status Report
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| Designated Country: |
AL AT BE CH CY DE DK ES FI FR GB GR IE IT LI LT LU LV MC MK NL PT RO SE SI
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| Family: |
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First Claim:
Show all claims |
1. An apparatus for stabilizing a polishing surface comprising:
- a substantially planar inflexible support base;
- a flexible polishing pad overlying said support base; and
- a vacuum port in said support base and underlying said polishing pad;
wherein application of vacuum through said vacuum port pulls said polishing pad against said support base to maintain said polishing pad in a predetermined polishing position.
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Description
Expand description |
The present invention relates to the field of polishing, and especially to chemical mechanical polishing. More specifically the present invention is directed to improvements in retention of the polishing surface and retention of polishing fluids during polishing.
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