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 Title: |
US5398010:
Molded waveguide components having electroless plated thermoplastic members
[ Derwent Title ]
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| Country: |
US United States of America
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| Inventor: |
Klebe, Douglas O.; Los Angeles, CA
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| Assignee: |
Hughes Aircraft Company, Los Angeles, CA
other patents from HUGHES AIRCRAFT COMPANY (260265) (approx. 5,163)
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| Published / Filed: |
1995-03-14
/ 1992-05-07
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| Application Number: |
US1992000880123
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| IPC Code: |
Advanced:
B29D 99/00;
H01P 3/12;
H01P 5/12;
H01P 5/18;
H01P 11/00;
Core:
H01P 3/00;
H01P 5/16;
more...
IPC-7:
B32B 31/14;
H01P 3/12;
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| ECLA Code: |
H01P11/00B1;
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| U.S. Class: |
Current:
333/239;
029/600;
156/150;
156/292;
333/248;
D13/155;
Original:
333/239;
333/248;
029/600;
156/150;
156/292;
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| Field of Search: |
333/239,248,241,242
156/304.2,242,245,150,292
029/600
138/139,143,145,151,157,171
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| Priority Number: |
| 1992-05-07 |
US1992000880123 |
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| Abstract: |
A microwave assembly having molded thermoplastic components that are first assembled into an enclosure, and then electroless copper plated to provide for RF conductivity. Assemblies are made by bonding bare thermoplastic components, after which the bonded assembly is electroless copper plated. The components are made of an injection molding material, polyetherimide, or a high strength, high temperature thermoplastic. The components are assembled using a one component epoxy adhesive, for example. All components are designed to be self locating to aid in assembly. A bonding fixture is used to apply clamping pressure to the components while the adhesive cures. After bonding, the waveguide assembly has its critical flange surfaces finish machined prior to plating.
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| Attorney, Agent or Firm: |
Alkov, Leonard A. ;
Denson-Low, W. K. ;
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| Primary / Asst. Examiners: |
Lee, Benny T.;
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| INPADOC Legal Status: |
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Family Legal Status Report
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| Designated Country: |
CH DE ES FR GB IT LI SE
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| Family: |
Show 14 known family members
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First Claim:
Show all 5 claims |
What is claimed is:
1. A molded microwave waveguide component comprising:
- a plurality of thermoplastic members having predefined shapes and sizes bonded with epoxy adhesive to define an enclosure, and wherein the enclosure has an internal electroless copper plated surface that is plated into a finished assembly in the fabrication thereof, and having a polyimide coating disposed over the copper plated surface, wherein the enclosure defining a microwave waveguide that is capable of transmitting microwave energy.
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| Background / Summary: |
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| Drawing Descriptions: |
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| Description: |
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| Forward References: |
Show 6 U.S. patent(s) that reference this one
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