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 Title: |
US5582242:
Thermosiphon for cooling a high power die
[ Derwent Title ]
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| Country: |
US United States of America
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| Inventor: |
Hamburgen, William R.; Palo Alto, CA
Fitch, John S.; Newark, CA
Jouppi, Norman P.; Palo Alto, CA
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| Assignee: |
Digital Equipment Corporation, Maynard, MA
other patents from DIGITAL EQUIPMENT CORPORATION (147695) (approx. 2,345)
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| Published / Filed: |
1996-12-10
/ 1995-05-04
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| Application Number: |
US1995000433663
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| IPC Code: |
Advanced:
H01L 23/427;
Core:
H01L 23/34;
IPC-7:
F28D 15/00;
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| ECLA Code: |
H01L23/427;
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| U.S. Class: |
Current:
165/104.21;
029/890.032;
165/076;
165/104.27;
165/104.33;
165/287;
257/E23.088;
361/700;
Original:
165/104.21;
165/104.27;
165/104.33;
165/076;
165/287;
361/700;
029/890.032;
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| Field of Search: |
165/032,104.26,104.27,104.33,104.21,76
361/707,700
257/720,715
029/890.032
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| Priority Number: |
| 1995-05-04 |
US1995000433663 |
| 1994-03-28 |
US1994000218877 |
| 1992-05-15 |
US1992000883544 |
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| Abstract: |
A thermosiphon provides cooling for a high powered die. The thermosiphon includes a fuse for accommodating temperature fault conditions. The thermosiphon utilizes a water and alcohol mixture for improved boiling characteristics. Contaminants at the joint betweeen the thermosiphon and the package housing are reduced by the use of a shrink ring seal. Thermal interfaces between the die and the thermosiphon are eliminated by directly coupling the die to the thermosiphon.
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| Attorney, Agent or Firm: |
Maloney, Denis G. ;
Fisher, Arthur W. ;
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| Primary / Asst. Examiners: |
Rivell, John; Atkinson, Christopher
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| INPADOC Legal Status: |
Show legal status actions
Family Legal Status Report
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| Related Applications: |
| Application Number |
Filed |
Patent |
Pub. Date |
Title |
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| US1994000218877 | 1994-03-28 |
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| US1992000883544 | 1992-05-15 |
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