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Title: US5850093: Uni-directional flash device
[ Derwent Title ]


Country: US United States of America

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68 pages

 
Inventor: Tarng, Huang Chang; San Jose, CA 95129
Tarng, Min Ming; San Jose, CA 95129

Assignee: None

Published / Filed: 1998-12-15 / 1997-07-14

Application Number: US1997000892358

IPC Code: Advanced: H01L 27/088; H01L 27/115; H01L 29/08; H01L 29/10; H01L 29/78; H01L 29/788;
Core: H01L 27/085; H01L 29/02; H01L 29/66; more...
IPC-7: H01L 27/10; H01L 29/78;

ECLA Code: H01L27/088; H01L27/115; H01L29/08E2; H01L29/10D2B1; H01L29/78C; H01L29/788B4;

U.S. Class: Current: 257/327; 257/335; 257/345; 257/654; 257/E27.06; 257/E27.103; 257/E29.04; 257/E29.052; 257/E29.262; 257/E29.304;
Original: 257/327; 257/335; 257/345; 257/654;

Field of Search: 257/329,327,345,653,654,335

Priority Number:
1997-07-14  US1997000892358
1995-04-10  US1995000419503
1992-09-09  US1992000932916
1989-11-20  US1989000439200

Abstract: The flash device is a field effect single cell device. The flash device has the source laying under the gate. The variance of gate voltage has the direct capacitor coupling and current injecting effects with the source to speed up the response of circuit. Furthermore, the process of the flash device is comparable with the CMOS device. It is an ideal device for the output buffer which has the anti-ground-bounce and anti-power-droop capabilities. The single cell technology is applied to the single cell active pixel to integrate four different components into one cell. The versatile operation is applied to have the super-flash EEPROM.

Primary / Asst. Examiners: Monin, Jr., Donald L.;

Maintenance Status: E1 Expired  Check current status

INPADOC Legal Status: Show legal status actions

       
Related Applications:
Application Number Filed Patent Pub. Date  Title
US1995000419503 1995-04-10       
US1992000932916 1992-09-09       
US1989000439200 1989-11-20       


       
Parent Case:     This is a continuation-in-part of Ser. No. 08/419,503, filed Apr. 10, 1995, now abandoned, which is a continuation-in-part of Ser. No. 07/932,916, filed Sep. 9, 1992, now abandoned, which is a continuation-in-part of Ser. No. 07/439,200, filed Nov. 20, 1989 now abandoned.

Family: None

First Claim:
Show all 71 claims
We claim:     1. A semiconductor device(FIG. 21A) comprising:
  • a first semiconductor region of first conductivity type, said first semiconductor region having a major surface;
  • second and third regions of second conductivity type in said first region, said third region being L shape region having a vertical segment and a horizontal segment, said second and said vertical segment of said third regions each adjoining said major surface, said third region being spaced from said second region by a portion of said first region, said horizontal segment of said third region buried inside said first region and under said major surface,
  • a gate electrode insulatingly overlaying a portion of said first region and right above the buried horizontal segment of said third region,
  • a drain electrode connected to said second region and a source electrode connected to said third region,
  • said second region having a portion laying under said gate, said vertical segment of said third region being away from said gate to have a single-side offset with said gate to form a surface drainage to drain carriers to elinimate electric shield formed by carriers that electric field of said gate being able to reach bulk portion of said first semiconductor region to form a bulk channel(FIG. 23A and FIG. 23B), but said third region having the buried horizontal segment laying directly under said gate,
  • whereby said structure forms a field effect transistor with said gate controlling the a buried portion and an interface between said buried portion and a channel portion, said channel portion of said first region being formed under the applied voltage of said gate to allow current flowing only from the buried portion of said third region to said second region.


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Forward References: Show 9 U.S. patent(s) that reference this one

       
U.S. References: Go to Result Set: All U.S. references   |  Forward references (9)   |   Backward references (5)   |   Citation Link

Buy
PDF
Patent  Pub.Date  Inventor Assignee   Title
Buy PDF- 6pp US4163985  1979-08 Schuermeyer et al.  The United States of America as represented by the Secretary of the Air Force Nonvolatile punch through memory cell with buried n+ region in channel
Buy PDF- 22pp US4471368  1984-09 Mohsen   Dynamic RAM memory and vertical charge coupled dynamic storage cell therefor
Buy PDF- 43pp US4994999  1991-02 Nishizawa  Zaidan Hojin Handotai Kenkyu Shinkokai High-speed and high-density semiconductor memory
Buy PDF- 19pp US5198691  1993-03 Tarn   BiMOS devices and BiMOS memories
Buy PDF- 30pp US5552623  1996-09 Nishizawa et al.  Handotai Kenkyu Shinkokai Short channel mosfet with buried anti-punch through region
       
Foreign References:
Buy
PDF
Publication Date IPC Code Assignee   Title
  JP61055963 1986-03       
  JP62229978 1987-10       
  JP63289870 1988-11       
  JP63300567 1988-12       
Buy PDF- 6pp GB2027992 1980-02  H01L 21/02 SIEMENS AG MOS FIELD EFFECT TRANSISTORS FOR HIGH VOLTAGE USE 


Other Abstract Info: DERABS G1999-069880 DERABS G1999-069880

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