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Title: US5858820: Thin film transistor-liquid crystal display and a manufacturing method thereof
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Country: US United States of America

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19 pages

 
Inventor: Jung, Byung-Hoo; Seoul, Republic of Korea
Jin, Yong-Suk; Kyungki-do, Republic of Korea
Lee, Joo-Hyung; Seoul, Republic of Korea
Hwang, Chang-Won; Seoul, Republic of Korea

Assignee: Samsung Electronics Co., Ltd., Kyungki-do, Republic of Korea
other patents from SAMSUNG ELECTRONICS CO., LTD. (491065) (approx. 12,932)
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Published / Filed: 1999-01-12 / 1996-05-17

Application Number: US1996000649517

IPC Code: Advanced: G02F 1/1362; H01L 21/20; H01L 21/336; H01L 21/77; H01L 21/84; H01L 27/12;
Core: H01L 21/02; H01L 21/70; more...
IPC-7: H01L 21/00; H01L 21/20; H01L 21/36; H01L 21/84;

ECLA Code: H01L21/77T; G02F1/1362D; H01L21/20D; H01L21/336D2C; H01L27/12;

U.S. Class: Current: 438/150; 257/E21.133; 257/E21.414; 257/E27.111; 438/166; 438/486;
Original: 438/150; 438/166; 438/486;

Field of Search: 438/149,150,151,164,166,482,158,486 257/347,352,353,354

Priority Number:
1995-05-17  KR1995000012232
1995-05-17  KR1995000012241

Abstract:     The present invention relates to a thin film transistor-liquid crystal display (hereinafter referred to as a TFT-LCD) and a manufacturing method thereof. An amorphous silicon is deposited on a substrate. The amorphous silicon is transformed into a poly silicon by method of solid phase crystallization, and the first poly silicon layer pattern is formed by etching. An amorphous silicon is deposited on the first poly silicon layer pattern. The amorphous silicon is transformed into a second poly silicon layer by method of solid phase crystallization.

Attorney, Agent or Firm: Pillsbury Madison & Sutro LLP ;

Primary / Asst. Examiners: Dutton, Brian;

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First Claim:
Show all 14 claims
What is claimed is:     1. A method for manufacturing a portion of a thin film transistor liquid crystal display including an active region comprising the steps of:
  • depositing a seed layer on a substrate;
  • forming a seed layer pattern by etching said seed layer;
  • epitaxially growing a silicon layer over said seed layer pattern and over portions of said substrate;
  • implanting ions in said silicon layer to obtain an ion implanted silicon layer; and
  • annealing said ion implanted silicon layer to obtain said active region of said thin film transistor liquid crystal display,
wherein said step of forming said seed layer pattern forms said seed layer pattern in a position that corresponds to a location between source and drain electrodes in said active region of said thin film transistor liquid crystal display.


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Forward References: Show 16 U.S. patent(s) that reference this one

       
U.S. References: Go to Result Set: All U.S. references   |  Forward references (16)   |   Backward references (5)   |   Citation Link

Buy
PDF
Patent  Pub.Date  Inventor Assignee   Title
Buy PDF- 14pp US5318919  1994-06 Noguchi et al.  Sanyo Electric Co., Ltd. Manufacturing method of thin film transistor
Buy PDF- 14pp US5389580  1995-02 Miyasaka  Seiko Epson Corporation Thin film semiconductor device and method of production
Buy PDF- 31pp US5508216  1996-04 Inoue  Seiko Epson Corporation Thin film transistor, solid device, display device and manufacturing method of a thin film transistor
Buy PDF- 14pp US5531182  1996-07 Yonehara  Canon Kabushiki Kaisha Method of making a semiconductor thin-film
Buy PDF- 10pp US5637515  1997-06 Takemura  Semiconductor Energy Laboratory Co., Ltd. Method of making thin film transistor using lateral crystallization
       
Foreign References: None

Other Abstract Info: CHEMABS 130(08)102992V CHEMABS 130(08)102992V DERABS C1999-119905 DERABS C1999-119905

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