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Title: |
US5883310:
Micromachined hot-wire shear stress sensor
[ Derwent Title ]

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Country: |
US United States of America

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Inventor: |
Ho, Chih-Ming; Rancho Palos Verdes, CA
Tai, Yu-Chong; Pasadena, CA
Jiang, Fukang; Alhambra, CA
Liu, Chang; Pasadena, CA
Huang, Jin-Biao; Los Angeles, CA

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Assignee: |
The Regents of the University of California, Oakland, CA
other patents from UNIVERSITY OF CALIFORNIA, THE REGENTS OF (599425) (approx. 4,840)
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Published / Filed: |
1999-03-16
/ 1995-04-25

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Application Number: |
US1995000428334

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IPC Code: |
Advanced:
G01F 1/684;
G01P 5/12;
Core:
G01P 5/10;
more...
IPC-7:
G01B 7/16;

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ECLA Code: |
G01F1/684M; G01P5/12;

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U.S. Class: |
Current:
073/766;
073/720;
073/777;
Original:
073/766;
073/777;
073/720;

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Government Interest: |
The United States Government has certain rights in this invention pursuant to Grant No. F 49620-92-J-0424 and F 4962-1-93-0332 awarded by the United States Air Force.

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Priority Number: |
| 1995-04-25 |
US1995000428334 |
| 1994-11-04 |
US1994000334422 |

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Abstract: |
A micromachined hot-wire anemometer having fast response times and higher sensitivities than conventional hot-wire anemometers is provided by micromachining doped polysilicon wires carried on silicon supports cantilevered from a substrate including one or more insulating layers disposed between said substrate and supports. The micromachined polysilicon hot-wire anemometer is fabricated using surface micromachining techniques.
A shear stress sensor is micromachined to define a thin diaphragm over a cavity defined in a substrate underlying the diaphragm. The cavity is evacuated, sealed, and a thermistor disposed over the diaphragm. The thermistor is thus thermally insulated from the substrate and provides a low profile shear stress sensor for measuring flow rates in boundary layers above a flow surface.

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Attorney, Agent or Firm: |
Dawes, Daniel L. ;

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Primary / Asst. Examiners: |
Noori, Max H.;

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INPADOC Legal Status: |
Show legal status actions

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