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 Title: |
US5905007:
Method for aligning and forming microelectromechanical systems (MEMS) contour surfaces
[ Derwent Title ]
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| Country: |
US United States of America
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| Inventor: |
Ho, Chih-Ming; Palos Verdes, CA
Li, Wen J.; Torrance, CA
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| Assignee: |
The Regents of the University of California, Oakland, CA
other patents from UNIVERSITY OF CALIFORNIA, THE REGENTS OF (599425) (approx. 4,840)
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| Published / Filed: |
1999-05-18
/ 1997-08-01
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| Application Number: |
US1997000904729
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| IPC Code: |
Advanced:
B81C 99/00;
G03F 7/24;
Core:
more...
IPC-7:
G03F 9/0/0;
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| ECLA Code: |
B81C1/00C10; G03F7/24; L81D1/00;
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| U.S. Class: |
Current:
430/022;
430/005;
430/319;
Original:
430/022;
430/005;
430/319;
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| Field of Search: |
430/022,5,319
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| Priority Number: |
| 1997-08-01 |
US1997000904729 |
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| Abstract: |
An integrated circuit, or microelectromechanical structure is defined onto a contour surface by utilizing a flexible mask upon which photolithographic patterns are first defined using conventional planar photolithographic techniques. The contour surface is provided with a thin film uniformly distributed on the surface and then the flexible mask is aligned with the contour substrate. Alignments are made through multiple stages of yaw alignment, translation alignment and rotational alignment. Once the mask is aligned with contour substrate it is then subjected while rotating to developing field, such as uniform illumination of ultraviolet light shining on the side of the contour substrate as it is rotated in the illumination field. The developed photoresist layer disposed on the surface of the contour substrate is thus developed and the underlying film etched according to the patterned mask in a manner similar to a conventional planar photolithography. Multiple layers are thus disposed masked and etched to result in complex multilayered integrated circuit and/or microelectromechanical devices disposed on the contour surface of a macromechanical component or structure.
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| Attorney, Agent or Firm: |
Dawes, Daniel L. ;
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| Primary / Asst. Examiners: |
Young, Christopher G.;
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| INPADOC Legal Status: |
Show legal status actions
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| Family: |
None
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First Claim:
Show all 19 claims |
We claim:
1. A method for fabricating micron or less sized devices onto a contoured surface of a substrate comprising:
- fabricating a patterned mask on a surface of a flexible film while said flexible film is in a flat condition to provide a flexible mask;
- disposing a photoresist layer onto said contoured surface of said substrate;
- aligning said patterned mask conformally on said contoured surface of said substrate; and
- exposing said mask and said photoresist on said contoured surface of said substrate to a developing field of energy so that selected portions of said photoresist on said contoured surface of said substrate are developed thereby transferring a pattern from said patterned mask to said photoresist layer on said contoured surface of said substrate.
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| Background / Summary: |
Show background / summary
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| Drawing Descriptions: |
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| Description: |
Show description
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| Forward References: |
Show 19 U.S. patent(s) that reference this one
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| Foreign References: |
None
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| Other Abstract Info: |
DERABS C1999-326377
DERABS C1999-326377
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| Other References: |
"A Concentric Build-Up Process to Fabricate Pratical Wobble Motors" by H. Ogura, et al. IEEE (Jan. 1994), pp. 114-118.
"Scanning Electron Micrograph [Image](SEM) Image of a Microelectromechanical System (MEMS) Sensor After Active Laser Trimming" Revise, Inc. (Sep. 8, 1996).
"Frabrication of Submicrometer Features on Curved Substrates by Microcontact Printing" by Jackman et al. Science vol. 269 (Aug. 4, 1995), pp. 664-666.
(3 pages)
Cited by 25 patents
[ISI abstract]
"Features of Gold Having Micrometer to Centimeter Dimensions Can Be Formed Through a Combination of Stamping With an Elastomeric. . . " by Amit Kumar et al., Appl. Phys. Lett. 63(14) (Oct. 4, 1993), pp. 2002-2004.
(3 pages)
Cited by 37 patents
[ISI abstract]
"Fabrication of Micro-Structures Using Non-Planar Lithography (NPL)" by Stephen C. Jacobsen et al. MEMS (1993), pp. 45-50.
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