 |
|
|
|
|
|
 Title: |
US5981955:
Isotope separation using a high field source and improved collectors
[ Derwent Title ]
|
| Country: |
US United States of America
|
| |
| Inventor: |
Wong, Alfred Y.; Los Angeles, CA
Rosenthal, Glenn B.; Los Angeles, CA
|
| Assignee: |
The Regents of the University of California, Oakland, CA
other patents from UNIVERSITY OF CALIFORNIA, THE REGENTS OF (599425) (approx. 4,840)
News, Profiles, Stocks and More about this company
|
| Published / Filed: |
1999-11-09
/ 1997-05-23
|
| Application Number: |
US1997000862605
|
| IPC Code: |
Advanced:
B01D 59/48;
H01J 49/10;
H05H 1/24;
Core:
B01D 59/00;
more...
IPC-7:
H01J 37/08;
|
| ECLA Code: |
B01D59/48;
|
| U.S. Class: |
Current:
250/423.R;
250/423.P;
315/111.81;
Original:
250/423.R;
250/423.P;
315/111.81;
|
| Field of Search: |
250/281,290,291,298,423 P,423 R
315/111.81
|
| Priority Number: |
| 1997-05-23 |
US1997000862605 |
| 1995-12-07 |
US1995000568583 |
|
| Abstract: |
A plasma chamber for use in isotope enrichment has a microwave feed to the ECRH microwave horns, which feed is led into the plasma chamber behind the sputter plate and perpendicular to the magnetic field for improved microwave waveguide routing and ease of microwave window handling and maintenance. Improved collector design includes a collector assembly placed behind the plasma source comprising a dump plate and flat and shield collector. A ring collector is provided outside the main plasma region in the case where two opposing magnetic mirrors are used and the resonant ions maintained between them. An improved collector assembly can also be provided by disposing the collector assembly in front of the plasma source region and having a double shield-and-slat collector for capturing high energy resonant ions or permitting passage of low energy ions therethrough. Sputter sources for nonconducting materials can be provided by using a thin surface coating applied to a metal backing. The surface coat has a thickness of approximately one ion implantation depth so that the backing plate bleeds the charge from the surface coat. The thin surface coat may continually be replenished within directed jet vapor from a plasma or a doped or filled conductive plasma sputter plate may be employed.
|
| Attorney, Agent or Firm: |
Dawes, Daniel L. ;
|
| Primary / Asst. Examiners: |
Anderson, Bruce C.;
|
| INPADOC Legal Status: |
Show legal status actions
Family Legal Status Report
|
|
|
|
|
|
|
| Parent Case: |
The present application is a continuation-in-part application of application Ser. No. 08/568,583 filed Dec. 7, 1995, now abandoned which is incorporated herein by reference and attached as an Appendix.
|
| Designated Country: |
BR CN EP JP RU
|
| Family: |
Show 2 known family members
|
First Claim:
Show all 33 claims |
We claim:
1. An improvement in a plasma chamber having a source region and an enrichment region contained within said plasma chamber, said source region provided with a plasma source for producing a plasma, said improvement comprising:
- a magnet assembly for generating a shaped magnetic field in said plasma chamber wherein said shaped field provides a higher magnetic field intensity in said source region than in said enrichment region so that as said plasma flows from said source region to said enrichment region, plasma temperature in a direction perpendicular to said magnetic field decreases,
- wherein said high field region comprises a magnetic mirror for discriminatory separation of isotopes of said plasma,
- wherein said plasma chamber is provided with a product plate and a dump plate, and wherein said magnetic mirror is disposed within said plasma chamber on the end of said plasma chamber opposing said source region so that nonresonant ions are discriminatorily disposed on a dump plate disposed behind said magnetic mirror and resonant ions are reflected to said opposing end of said plasma chamber and deposited on a product plate.
|
| Background / Summary: |
Show background / summary
|
| Drawing Descriptions: |
Show drawing descriptions
|
| Description: |
Show description
|
| Forward References: |
Show 2 U.S. patent(s) that reference this one
|
|
