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Title: US6218846: Multi-probe impedance measurement system and method for detection of flaws in conductive articles
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Country: US United States of America

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38 pages

 
Inventor: Ludwig, Reinhold; Worcester, MA
McNeill, John A.; Stow, MA
Stander, Jennifer A.; Boylston, MA

Assignee: Worcester Polytechnic Institute, Worcester, MA
other patents from WORCESTER POLYTECHNIC INSTITUTE (633135) (approx. 25)
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Published / Filed: 2001-04-17 / 1997-08-01

Application Number: US1997000904789

IPC Code: Advanced: G01R 1/073; G01R 31/28;
Core: more...
IPC-7: G01R 27/00;

ECLA Code: G01R1/073B4; G01R31/28B5B;

U.S. Class: Current: 324/713; 324/715; 324/718;
Original: 324/713; 324/715; 324/718;

Field of Search: 324/713,715,718,722,724

Priority Number:
1997-08-01  US1997000904789

Abstract:     An innovative multi-dimensional, low frequency, impedance measurement probe array, measurement system, and method are disclosed for detecting flaws in conductive articles. The device and method provide for contacting a conductive article with an multi-probe array of current and voltage probes, injecting current sequentially through a plurality of current probe pairs and measuring absolute or relative voltages with a plurality of voltage probes and voltage probe pairs across the surface of an article for each current flow condition. The device and method further provide for constructing a voltage profile across the surface of an article where disruptions in the voltage profile enable detection of the presence, location and orientation of flaws for flaw sizes as low as 20 um. The innovative probe array and method provide for rapidly detecting cracks, inclusions, defects and other flaws in conductive articles and can be adapted and deployed as either a two-dimensional, planar array or three-dimensional shaped array for a variety of sample configurations and surfaces. By utilizing a plurality of current and voltage probes in an array format, the device and method overcomes existing limitations of conventional linear probes and traditional methods by enabling flaw detection over larger areas in a single probe placement while achieving a high degree of sensitivity and precision in determining flaw location and orientation.

Attorney, Agent or Firm: Creehan, R. Dennis ;

Primary / Asst. Examiners: Ballato, Josie; Sundaram, T. R.

Maintenance Status: R2 Reinstated

INPADOC Legal Status: Show legal status actions

Family: None

First Claim:
Show all 33 claims
What is claimed is:     1. A method for detecting flaws in a conductive article comprising:
  • contacting a surface of said article with a non-linear array of probes comprising at least three voltage probes and at least three current probes;
  • selecting predetermined pairs of said current probes;
  • selecting predetermined pairs of said voltage probes;
  • passing current through said article by means of each of said predetermined pairs of said current probes, said current passing sequentially through each of said current probe pairs, one pair at a time, at varying directions to said voltage probes;
  • measuring voltage produced by each of said currents at predetermined locations on a surface of said article, said voltage measured between each of said pairs of said voltage probes for each current flow condition; and
  • detecting the presence, location, size and orientation of flaws in said article, wherein the presence of said flaws in said article creates a detectable and statistically significant disturbance in a voltage profile generated from said voltages measured over said surface of said article, said disturbances indicative of the location, size, depth and orientation of said flaws.


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Forward References: Show 11 U.S. patent(s) that reference this one

       
U.S. References: Go to Result Set: All U.S. references   |  Forward references (11)   |   Backward references (5)   |   Citation Link

Buy
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Patent  Pub.Date  Inventor Assignee   Title
Buy PDF- 16pp US4178543  1979-12 Wrinn  Teradyne, Inc. Analyzing electrical circuit boards
Buy PDF- 15pp US4667149  1987-05 Cohen et al.  American Telephone and Telegraph Company, AT&T Bell Laboratories Precision nondestructive testing of metals
Buy PDF- 8pp US4888546  1989-12 Berry  The United States of America as represented by the Secretary of the Army Device for measuring seam resistance
Buy PDF- 19pp US5136252  1992-08 Witt  AT&T Bell Laboratories Apparatus and methods for evaluating resistive bodies
Buy PDF- 13pp US5227731  1993-07 Prabhakaran et al.  The United States of America as represented by the Administrator of the National Aeronautics and Space Administration Method of continuously determining crack length
       
Foreign References: None

Other References:
  • Anonymous, "AT&T Microhmeter User Guide", AT&T Product Manual, Feb. 1986.
  • A.D. Seagar, et al., "Theorectical limits to sensitivity and resolustion in impedance imaging", Clin.Phys.Physiol.Meas., 1987, vol. 8, Suppl. A, p.13-31.
  • B.H.Brown, et al., "The Sheffield data collection system", Clin.Phys.Physiol.Meas., 1987, vol. 8, Suppl. A, p.91-97.
  • H.M.Powell, et al., "Impedance imaging using linear electrode arrays", Clin.Phys.Physiol.Meas., 1987, vol. 8, Suppl. A, p.109-118.
  • K. Ikeda, et al., "Electrical potential drop method for evaluatig crack depth", International Journal of Fracture 47:25-38, 1991. (14 pages) [ISI abstract]
  • P.R.Frise, et al., "Improved Probe Array for ACPD Crack Measurements", British Journal of NDT, vol. 34, No. 1, Jan. 1992, p.15-19. (5 pages) [ISI abstract]
  • Barend Van Den Bos, "The DC Potential Drop Method for Non Destructive Testing of P/M Components in Green and Sintered State", Jernkontorets Forskning, Final Report, Project No. 8076/92, Serie D (T080-37), Nr 750, Jun. 28, 1996.
  • R.L.Cohen, et al., "Characterization of Metals and Alloys by Electrical Resistivity Measurements", Materials Evaluation/ 41/ Aug. 1983, p. 1074-1077. (4 pages) Cited by 2 patents
  • Leander F. Pease III, Flaw Detection in P/M Parts via Real Time X-Ray Analysis, Eddy Currents, and Electrical Resistivity, 1988 Int. Powder Metallurgy Conf., MPIF (Princeton, NJ, 1988) p. 105-125.
  • Anna Lewis, et al., "Resistivity Measurement for Evaluation of Coating Thickness", Materials Evaluation / Feb. 1991, p. 132-135. (4 pages) [ISI abstract]
  • Leander F. Pease III, "Crack Detection in Green and Sintered P/M Parts", 1992 Powder Metallurgy World Congress, San Francisco, CA, Jun. 21-26, 1992, p. 1-24.
  • Duane P. Johnson, et al., "Nondestructive Flaw Detection and Density Measurements in Powder Metallurgy Parts", Advances in P/M and Particulate Materials, vol. 2, MPIF (Princeton, NJ, 1992) p. 281-289.
  • R.E. Shannon, et al., "Nondesctructive Evaluation for Large-Scale Metal-Matrix Composite Billet Processing", Metallurgical Transactions A, vol. 23A, May 1992, p. 1541-1549. (9 pages) [ISI abstract]
  • Duane P. Johnson, "Nondestructive Flaw Detection and Density Measurements in Powder Metallurgy Parts--Part II", Industrial Heating / Aug. 1996, p. 41-45.


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