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 Title: |
US6531759:
Alpha particle shield for integrated circuit
[ Derwent Title ]
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| Country: |
US United States of America
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| Inventor: |
Wachnik, Richard A.; Mount Kisco, NY
Nye, III, Henry A.; Brookfield, CT
Davis, Charles R.; Fishkill, NY
Zabel, Theodore H.; Yorktown Heights, NY
Restle, Phillip J.; Katonah, NY
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| Assignee: |
International Business Machines Corporation, Armonk, NY
other patents from INTERNATIONAL BUSINESS MACHINES CORPORATION (280070) (approx. 44,393)
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| Published / Filed: |
2003-03-11
/ 2001-02-06
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| Application Number: |
US2001000777540
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| IPC Code: |
Advanced:
H01L 21/60;
H01L 21/768;
H01L 23/556;
IPC-7:
H01L 23/552;
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| ECLA Code: |
H01L23/556; H01L24/11; T01L924/01042; T01L924/01073; T01L924/01074; T01L924/01075; T01L924/01079; T01L924/14000; T01L924/30105; T01L924/30107; T01L924/30250; T01L224/13099; T01L924/01013; T01L924/01022; T01L924/01029; T01L924/01077;
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| U.S. Class: |
Current:
257/659;
257/642;
257/643;
257/660;
257/E21.508;
257/E21.576;
257/E21.582;
257/E23.115;
438/082;
438/725;
Original:
257/659;
257/660;
257/642;
257/643;
438/082;
438/725;
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| Field of Search: |
257/659,660,642,643,546
174/035
357/051,54,68
365/053,149
029/591
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| Priority Number: |
| 2001-02-06 |
US2001000777540 |
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| Abstract: |
An integrated circuit, comprising: a semiconductor substrate, a plurality of last metal conductors disposed above said substrate, a bottom metallic layer disposed on said last metal conductors, a top metallic layer, and an alpha absorber disposed between said bottom and top metallic layers, said alpha absorber consisting essentially of a high-purity metal which is an alpha-particle absorber. The metal is, for example, of Ta, W, Re, Os or Ir.
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| Attorney, Agent or Firm: |
Abate, Joseph P. ;
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| Primary / Asst. Examiners: |
Smith, Matthew; Keshavan, B V
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| INPADOC Legal Status: |
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| Family: |
Show 2 known family members
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First Claim:
Show all 6 claims |
What is claimed is:
1. An integrated circuit comprising:
- a semiconductor substate,
- a plurality of last metal conductors disposed above said substrate,
- a bottom metallic layer disposed on and electrical contacting said last metal conductors,
- a top metallic layer, and
- an alpha absorber disposed between said bottom and top metallic layers, said alpha absorber consisting essentially of a high-purity metal which is an alpha-particle absorber.
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| Background / Summary: |
Show background / summary
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| Drawing Descriptions: |
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| Description: |
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| Forward References: |
Show 6 U.S. patent(s) that reference this one
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