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Title: US6750431: Electric component removing device
[ Derwent Title ]


Country: US United States of America

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13 pages

 
Inventor: Miyazaki, Mitsuhiko; Higashiosaka, Japan

Assignee: Hakko Corporation, Osaka, Japan
other patents from HAKKO CORPORATION (237810) (approx. 14)
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Published / Filed: 2004-06-15 / 2002-08-19

Application Number: US2002000224272

IPC Code: Advanced: B23K 1/018; H05K 3/34; H05K 13/04; H01R 43/20;
Core: more...
IPC-7: H05B 3/00;

ECLA Code: H05K13/04K1;

U.S. Class: 219/234; 219/227; 294/099.2;

Field of Search: 219/234,227-229 294/99.2,119.1 433/162 606/210-211

Priority Number:
2002-07-24  JP2002000215789

Abstract: A tweezer-type hand-held device for removing an electric or electronic component from a substrate is provided with a pair of contact pieces to be brought into contact with the component to grasp and heat the component and melt solder which fixes the component on the substrate. The contacts are respectively held by a pair of legs which, in turn, are interconnected with each other such that one of the legs moves toward the other with the legs and contact pieces being kept in parallel with each other.

Attorney, Agent or Firm: Squire, Sanders & Dempsey, LLP ;

Primary / Asst. Examiners: Jeffery, John A.;

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First Claim:
Show all 14 claims
What is claimed is:     1. A handheld component removing device comprising:
  • a pair of legs respectively provided, at their free ends, with contact pieces for grasping and heating the component;
  • an interconnecting mechanism for interconnecting the legs in a manner that a first leg moves toward and away from a second leg with the first and second legs being kept in parallel with each other; and
  • a pair of holders for detachably holding the legs, and wherein the interconnecting mechanism interconnects the legs via the pair of holders.


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Description: Show description

Forward References: Show 10 U.S. patent(s) that reference this one

       
U.S. References: Go to Result Set: All U.S. references   |  Forward references (10)   |   Backward references (10)   |   Citation Link

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Patent  Pub.Date  Inventor Assignee   Title
Get PDF - 3pp US2334252* 1943-11 Darling    
Get PDF - 4pp US3304111* 1967-02 Kauh et al.    
Get PDF - 8pp US3804320  1974-04 Vandermark  Nu-Concept Computer Systems, Inc. PACK EXTRACTOR
Get PDF - 8pp US4034202  1977-07 Vandermark  Nu-Concept Computer Systems, Inc. Integrated circuit pack extractor
Get PDF - 8pp US4553021  1985-11 Conti   Pincer-gun for electrically heating metal hinges of thermoplastic eyeglass frames
Get PDF - 13pp US5145101  1992-09 Brown et al.  Pace Incorporated Tweezer handpiece for installation and removal of electronic components with respect to a substrate and tips and tool for use therewith
Get PDF - 12pp US5246157  1993-09 Siegel  Pace, Incorporated Tool for use with tweezer handpiece for installation and removal of electronic components with respect to a substrate
Get PDF - 10pp US5690847  1997-11 LaValley et al.  Metcal, Inc. Pivotal tweezer having gears and self-regulating curie-point heaters
Get PDF - 15pp US5938258  1999-08 Femling  Master Appliance Corp. Power actuated tweezer
Get PDF - 13pp US6235027  2001-05 Herzon   Thermal cautery surgical forceps
  * some details unavailable
       
Foreign References:
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Publication Date IPC Code Assignee   Title
Buy PDF - 6pp DE19929255 2001-02  A61B 17/68 Karl Leibinger Medizintechnik GmbH & Co. KG Vorrichtung und Verfahren zum Verformen von Platten für Knochenbehandlungen 
  JP57048241 1982-03       
  JP2000139935 2000-05       


Other Abstract Info: DERABS C2004-121848

Continuity Data:
Application Number Filed Notes

US2003000178910F   is a continuation of
>US2002000224272<  2002-08-19   (pending) [presumed granted]
     US6750431 issued 2004-06-15   Electric component removing device

US2003000178906F   is a continuation of
>US2002000224272<  2002-08-19
     US6750431 issued 2004-06-15   Electric component removing device


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