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Title: |
US6750431:
Electric component removing device
[ Derwent Title ]

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Country: |
US United States of America

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Inventor: |
Miyazaki, Mitsuhiko; Higashiosaka, Japan

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Assignee: |
Hakko Corporation, Osaka, Japan
other patents from HAKKO CORPORATION (237810) (approx. 14)
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Published / Filed: |
2004-06-15
/ 2002-08-19

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Application Number: |
US2002000224272

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IPC Code: |
Advanced:
B23K 1/018;
H05K 3/34;
H05K 13/04;
H01R 43/20;
Core:
more...
IPC-7:
H05B 3/00;

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ECLA Code: |
H05K13/04K1;

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U.S. Class: |
219/234;
219/227;
294/099.2;

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Field of Search: |
219/234,227-229
294/99.2,119.1
433/162
606/210-211

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Priority Number: |

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Abstract: |
A tweezer-type hand-held device for removing an electric or electronic component from a substrate is provided with a pair of contact pieces to be brought into contact with the component to grasp and heat the component and melt solder which fixes the component on the substrate. The contacts are respectively held by a pair of legs which, in turn, are interconnected with each other such that one of the legs moves toward the other with the legs and contact pieces being kept in parallel with each other.

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Attorney, Agent or Firm: |
Squire, Sanders & Dempsey, LLP ;

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Primary / Asst. Examiners: |
Jeffery, John A.;

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INPADOC Legal Status: |
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Family: |
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First Claim:
Show all 14 claims |
What is claimed is:
1. A handheld component removing device comprising:
- a pair of legs respectively provided, at their free ends, with contact pieces for grasping and heating the component;
- an interconnecting mechanism for interconnecting the legs in a manner that a first leg moves toward and away from a second leg with the first and second legs being kept in parallel with each other; and
- a pair of holders for detachably holding the legs, and wherein the interconnecting mechanism interconnects the legs via the pair of holders.

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Background / Summary: |
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Drawing Descriptions: |
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Description: |
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Forward References: |
Show 10 U.S. patent(s) that reference this one

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