 |
 |
|
|
|
|
Title: |
US6927992:
Trace-impedance matching at junctions of multi-load signal traces to eliminate termination
[ Derwent Title ]

|
Country: |
US United States of America

|
| |
Inventor: |
Yen, Yao Tung; Cupertino, CA, United States of America

|
Assignee: |
Pericom Semiconductor Corp., San Jose, CA, United States of America
other patents from PERICOM SEMICONDUCTOR CORP. (713978) (approx. 58)
News, Profiles, Stocks and More about this company

|
Published / Filed: |
2005-08-09
/ 2003-12-01

|
Application Number: |
US2003000707249

|
IPC Code: |
Advanced:
G11C 5/06;
G11C 7/10;
H05K 1/02;
Core:
more...
IPC-7:
G11C 5/06;

|
ECLA Code: |
G11C5/06H; G11C7/10S; H05K1/02C4;

|
U.S. Class: |
365/063;
365/185.27;
365/051;

|
Field of Search: |
365/063,185.27,51,52,129,233
710/100

|
Priority Number: |

|
Abstract: |
A module board has trace impedances that are matched at trace junctions. An input line that drives a signal to a junction has its impedance adjusted to match the equivalent impedance of branch traces output from the junction. Since input and output impedances match, reflections caused by the junction are minimized or eliminated. The input impedance can match by being within 20% of the equivalent impedance of the branch lines. The equivalent impedance of branches is the reciprocal of the sum of the individual branch lines' reciprocal impedance. Termination can be eliminated when such junctions are impedance-matched. Secondary junctions can also be impedance-matched, allowing for a variety of trace topologies. Such trace-impedance matching is especially useful for memory modules.

|
Attorney, Agent or Firm: |
Auvinen, Stuart T. ;

|
Primary / Asst. Examiners: |
Nguyen, Van Thu; Nguyen, Dang T.

|
INPADOC Legal Status: |
Show legal status actions
Family Legal Status Report

|
 |
 |
|
|
|
|
U.S. References: |
Go to Result Set:
All U.S. references
| Forward references (1)
|
Backward references (18)
|
Citation Link

Buy PDF |
Patent |
Pub.Date |
Inventor |
Assignee |
Title |
 |
US4578652 |
1986-03 |
Sterns |
ITT Corporation |
Broadband four-port TEM mode 180° printed circuit microwave hybrid
|
 |
US5260892 |
1993-11 |
Testa et al. |
Sun Microsystems, Inc. |
High speed electrical signal interconnect structure
|
 |
US5426405 |
1995-06 |
Miller et al. |
Hewlett-Packard Company |
Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects
|
 |
US5532954 |
1996-07 |
Bechtolsheim et al. |
Sun Microsystems, Inc. |
Single in-line memory module
|
 |
US6061263 |
2000-05 |
Boaz et al. |
Intel Corporation |
Small outline rambus in-line memory module
|
 |
US6067594 |
2000-05 |
Perino et al. |
Rambus, Inc. |
High frequency bus system
|
 |
US6078965 |
2000-06 |
Mellitz et al. |
Intel Corporation |
Transmission line system for printed circuits
|
 |
US6104629 |
2000-08 |
Wu |
International Business Machines Corporation |
High frequency memory module
|
 |
US6125419 |
2000-09 |
Umemura et al. |
Hitachi, Ltd. |
Bus system, printed circuit board, signal transmission line, series circuit and memory module
|
 |
US6236572 |
2001-05 |
Teshome et al. |
Dell USA, L.P. |
Controlled impedance bus and method for a computer system
|
 |
US6381164 |
2002-04 |
Fan et al. |
High Connection Density, Inc. |
Low profile, high density memory system
|
 |
US6437660 |
2002-08 |
Sullivan |
Hybricon Corporation |
Method of increasing bus performance to reduce signal propagation delay and achieve incident wave switching
|
 |
US6441428 |
2002-08 |
Ghodsi |
Micron Technology, Inc. |
One-sided floating-gate memory cell
|
 |
US6449166 |
2002-09 |
Sly et al. |
High Connection Density, Inc. |
High capacity memory module with higher density and improved manufacturability
|
 |
US6484299 |
2002-11 |
Larsen |
Micron Technology, Inc. |
Method and apparatus for PCB array with compensated signal propagation
|
 |
US6487086 |
2002-11 |
Ikeda et al. |
NEC Corporation |
Circuit module
|
 |
US6515555 |
2003-02 |
Leddige et al. |
Intel Corporation |
Memory module with parallel stub traces
|
 |
US6542393 |
2003-04 |
Chu et al. |
MA Laboratories, Inc. |
Dual-bank memory module with stacked DRAM chips having a concave-shaped re-route PCB in-between
|
|
|