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Title: US6927992: Trace-impedance matching at junctions of multi-load signal traces to eliminate termination
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Country: US United States of America

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19 pages

 
Inventor: Yen, Yao Tung; Cupertino, CA, United States of America

Assignee: Pericom Semiconductor Corp., San Jose, CA, United States of America
other patents from PERICOM SEMICONDUCTOR CORP. (713978) (approx. 58)
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Published / Filed: 2005-08-09 / 2003-12-01

Application Number: US2003000707249

IPC Code: Advanced: G11C 5/06; G11C 7/10; H05K 1/02;
Core: more...
IPC-7: G11C 5/06;

ECLA Code: G11C5/06H; G11C7/10S; H05K1/02C4;

U.S. Class: 365/063; 365/185.27; 365/051;

Field of Search: 365/063,185.27,51,52,129,233 710/100

Priority Number:
2003-12-01  US2003000707249
2003-05-12  US2003000249845

Abstract:     A module board has trace impedances that are matched at trace junctions. An input line that drives a signal to a junction has its impedance adjusted to match the equivalent impedance of branch traces output from the junction. Since input and output impedances match, reflections caused by the junction are minimized or eliminated. The input impedance can match by being within 20% of the equivalent impedance of the branch lines. The equivalent impedance of branches is the reciprocal of the sum of the individual branch lines' reciprocal impedance. Termination can be eliminated when such junctions are impedance-matched. Secondary junctions can also be impedance-matched, allowing for a variety of trace topologies. Such trace-impedance matching is especially useful for memory modules.

Attorney, Agent or Firm: Auvinen, Stuart T. ;

Primary / Asst. Examiners: Nguyen, Van Thu; Nguyen, Dang T.

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Related Applications: Go to Result Set: 1 patent(s) that list this one as related
Application Number Filed Patent Pub. Date  Title
US2003000249845 2003-05-12       


       
Parent Case: CROSS REFERENCE TO RELATED APPLICATIONS
    This application is a continuation-in-part of the co-pending application for “DDR Memory Modules With Input Buffers Driving Split Traces with Trace-Impedance Matching at Trace Junctions”, U.S. Ser. No. 10/249,845, filed May 12, 2003.

Family: Show 3 known family members

First Claim:
Show all 18 claims
    1. A trace-impedance-matched board comprising:

a substrate containing wiring traces that include an input trace ending at a first junction;

a plurality of branch traces on the substrate, the plurality of branch traces branching from the first junction to a plurality of endpoints;

wherein a first equivalent impedance is a reciprocal of a sum of reciprocals of branch impedances of branch traces branching from the first junction in the plurality of branch traces;

wherein an input impedance of the input trace is adjusted to match the first equivalent impedance

wherein a width of the input trace is matched to a sum of widths of branch traces branching from the first junction.



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Forward References: Show 1 U.S. patent(s) that reference this one

       
U.S. References: Go to Result Set: All U.S. references   |  Forward references (1)   |   Backward references (18)   |   Citation Link

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PDF
Patent  Pub.Date  Inventor Assignee   Title
Buy PDF- 8pp US4578652  1986-03 Sterns  ITT Corporation Broadband four-port TEM mode 180° printed circuit microwave hybrid
Buy PDF- 11pp US5260892  1993-11 Testa et al.  Sun Microsystems, Inc. High speed electrical signal interconnect structure
Buy PDF- 19pp US5426405  1995-06 Miller et al.  Hewlett-Packard Company Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects
Buy PDF- 14pp US5532954  1996-07 Bechtolsheim et al.  Sun Microsystems, Inc. Single in-line memory module
Buy PDF- 11pp US6061263  2000-05 Boaz et al.  Intel Corporation Small outline rambus in-line memory module
Buy PDF- 29pp US6067594  2000-05 Perino et al.  Rambus, Inc. High frequency bus system
Buy PDF- 25pp US6078965  2000-06 Mellitz et al.  Intel Corporation Transmission line system for printed circuits
Buy PDF- 8pp US6104629  2000-08 Wu  International Business Machines Corporation High frequency memory module
Buy PDF- 35pp US6125419  2000-09 Umemura et al.  Hitachi, Ltd. Bus system, printed circuit board, signal transmission line, series circuit and memory module
Buy PDF- 11pp US6236572  2001-05 Teshome et al.  Dell USA, L.P. Controlled impedance bus and method for a computer system
Buy PDF- 18pp US6381164  2002-04 Fan et al.  High Connection Density, Inc. Low profile, high density memory system
Buy PDF- 6pp US6437660  2002-08 Sullivan  Hybricon Corporation Method of increasing bus performance to reduce signal propagation delay and achieve incident wave switching
Buy PDF- 17pp US6441428  2002-08 Ghodsi  Micron Technology, Inc. One-sided floating-gate memory cell
Buy PDF- 13pp US6449166  2002-09 Sly et al.  High Connection Density, Inc. High capacity memory module with higher density and improved manufacturability
Buy PDF- 15pp US6484299  2002-11 Larsen  Micron Technology, Inc. Method and apparatus for PCB array with compensated signal propagation
Buy PDF- 17pp US6487086  2002-11 Ikeda et al.  NEC Corporation Circuit module
Buy PDF- 7pp US6515555  2003-02 Leddige et al.  Intel Corporation Memory module with parallel stub traces
Buy PDF- 12pp US6542393  2003-04 Chu et al.  MA Laboratories, Inc. Dual-bank memory module with stacked DRAM chips having a concave-shaped re-route PCB in-between
       
Foreign References: None

Continuity Data:
Application Number Filed Notes

US2003000710475   is a continuation in part of
>US2003000707249<  2003-12-01
     US6927992 issued 2005-08-09   Trace-impedance matching at junctions of multi-load signal traces to eliminate termination

>US2003000707249<   is a continuation in part of
US2003000249845  2003-05-12   (pending) [presumed granted]
     US6947304 issued 2005-09-20   DDR memory modules with input buffers driving split traces with trace-impedance matching at trace junctions

>US2003000707249<   is a continuation in part of
US2003000249845  2003-05-12
     US6947304 issued 2005-09-20   DDR memory modules with input buffers driving split traces with trace-impedance matching at trace junctions


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