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Title: US7131040: Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane
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Country: US United States of America

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17 pages

 
Inventor: Co, Ramon S.; Trabuco Canyon, CA, United States of America
Lai, Tat Leung; Torrance, CA, United States of America
Sun, David; Irvine, CA, United States of America

Assignee: Kingston Technology Corp., Fountain Valley, CA, United States of America
other patents from KINGSTON TECHNOLOGY COMPANY (741845) (approx. 14)
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Published / Filed: 2006-10-31 / 2005-02-14

Application Number: US2005000906318

IPC Code: Advanced: G01R 31/28; G11C 29/00; G11C 29/56; G01R 31/319;
Core: more...

ECLA Code: G11C29/56; S01R31/28G2B2; S01R31/319C1;

U.S. Class: 714/718; 365/201; 324/760;

Field of Search: Non/00e

Priority Number:
2005-02-14  US2005000906318
2003-05-12  US2003000249843

Abstract:     Hot air blown past memory modules under test in a heat chamber is improved. Hot air entering the chamber from an inlet pipe is split by a manifold and deflectors. Holes in the manifold allow for a relatively even air distribution within the chamber, minimizing temperature variations. Return air is collected by a heat-chamber bottom cover into a return pipe. A heating unit re-heats the return air and blows it into the inlet pipe. One side of the heat chamber is an insulated backplane. Memory modules are inserted into sockets on module motherboards, which are inserted into motherboard sockets on the backplane. On the other side of the backplane, card sockets receive pattern-generator cards outside the heat chamber but electrically connected to the module motherboards through the backplane. The pattern-generator cards exercise the memory modules. The pattern-generator cards are cooled while memory modules in the heat chamber are heated.

Attorney, Agent or Firm: Auvinen, Stuart T. ; g Patent LLC ;

Primary / Asst. Examiners: Decady, Albert; Trimmings, John P.

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Related Applications:
Application Number Filed Patent Pub. Date  Title
US2003000249843 2003-05-12    2005-06-21  Memory-module burn-in system with removable pattern-generator boards separated from heat chamber by backplane


       
Parent Case: RELATED APPLICATION
    This application is a continuation-in-part of the co-pending application for “Memory-Module Burn-In System with Removable Pattern-Generator Boards Separated from Heat Chamber by Backplane”, U.S. Ser. No. 10/249,843, filed May 12, 2003, now U.S. Pat. No. 6,910,162.

Family: Show 6 known family members

First Claim:
Show all 21 claims
    1. A forced-air environmental tester for memory modules comprising:

a backplane forming one side of an environmental chamber;

motherboard sockets mounted on a first side of the backplane;

removable module motherboards for insertion into the motherboard sockets;

a plurality of memory-module sockets mounted on each of the removable module motherboards, the plurality of memory module sockets for receiving memory modules for environmental testing in the environmental tester;

card sockets mounted on a second side of the backplane;

removable pattern-generator cards for insertion into the card sockets;

a pattern generator on each of the removable pattern-generator cards for generating address, data, and control signals to write data to a plurality of memory locations on memory chips on the memory modules inserted into the memory-module sockets on the removable module motherboards;

an inlet duct carrying forced air into the environmental chamber;

an air-flow distributor situated between the inlet duct and the removable module motherboards when inserted into the motherboard sockets;

a return duct that carries return air from the environmental chamber; and

an air collector situated between the return duct and the removable module motherboards when inserted into the motherboard sockets,

whereby memory modules are tested within the environmental chamber by pattern generators on removable pattern-generator cards outside the environmental chamber that are separated by the backplane that forms one side of the environmental chamber.



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U.S. References: Go to Result Set: All U.S. references   |  No patents reference this one   |   Backward references (17)   |   Citation Link

Buy
PDF
Patent  Pub.Date  Inventor Assignee   Title
Buy PDF- 63pp US5093982  1992-03 Gussman  Reliability Incorporated Automated burn-in system
Buy PDF- 34pp US5359285  1994-10 Hashinaga et al.  Sumitomo Electric Industries, Ltd. Method and apparatus for varying temperature and electronic load conditions of a semiconductor device in a burn-in test chamber while performing a burn-in test
Buy PDF- 10pp US5420521  1995-05 Jones  EJ Systems, Inc. Burn-in module
Buy PDF- 15pp US5574384  1996-11 Oi  Tabai Espec Corp. Combined board construction for burn-in and burn-in equipment for use with combined board
Buy PDF- 16pp US5851143  1998-12 Hamid  Thermal Industries Disk drive test chamber
Buy PDF- 13pp US5903163  1999-05 Tverdy et al.  Micron Technology, Inc. Apparatus and method of controlling the environmental temperature near semiconductor devices under test
Buy PDF- 9pp US6057698  2000-05 Heo et al.  Samsung Electronics Co., Ltd. Test system for variable selection of IC devices for testing
Buy PDF- 20pp US6357023  2002-03 Co et al.  Kingston Technology Co. Connector assembly for testing memory modules from the solder-side of a PC motherboard with forced hot air
Buy PDF- 11pp US6367044  2002-04 Komoike  Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device
Buy PDF- 30pp US7070323  2006-07 Wanek et al.  Pemstar, Inc. Environmental test chamber and a carrier for use therein
Buy PDF- 12pp US20020070745A1  2002-06 Johnson et al.   Cooling system for burn-in unit
Buy PDF- 8pp US20020186031A1  2002-12 Pelissier   Method and apparatus for temperature control of a device during testing
Buy PDF- 8pp US20030094939A1  2003-05 Matsuzawa   Electronic devices mounted on electronic equipment board test system and test method
Buy PDF- 11pp US20030112025A1  2003-06 Hamilton et al.   Temperature control system for burn-in boards
Buy PDF- 30pp US20030121337A1  2003-07 Wanek et al.   Environmental test chamber and a carrier for use therein
Buy PDF- 27pp US20040008484A1  2004-01 Konshak et al.   Forced air system for cooling a high density array of disk drives
Buy PDF- 15pp US20050179457A1  2005-08 Min et al.   Burn-in test apparatus for BGA packages using forced heat exhaust
       
Foreign References: None

Continuity Data:
Application Number Filed Notes

US2005000906318 2005-02-14  is a related to the prior publication
     US20050125712A1 issued 2005-06-09  Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane

US2006000306753 2006-01-10  is a continuation in part of
>US2005000906318<  2005-02-14   (pending) [presumed granted]
     US7131040 issued 2006-10-31   Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane

11306753   is a continuation in part of
>US2005000906318<  2005-02-14   (pending) [presumed granted]
     US7131040 issued 2006-10-31   Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane

US2006000306753 2006-01-10  is a continuation in part of
US2003000249843  2003-05-12   (granted)
     US6910162 issued 2005-06-21   Memory-module burn-in system with removable pattern-generator boards separated from heat chamber by backplane

>US2005000906318< 2005-02-14  is a continuation in part of
US2003000249843  2003-05-12   (pending) [presumed granted]
     US6910162 issued 2005-06-21   Memory-module burn-in system with removable pattern-generator boards separated from heat chamber by backplane

US2004000906318   is a continuation in part of
US2003000249843  2003-05-12
     US6901162 issued 2005-05-31 2005-06-21  Image display device

US2004000906318   is a continuation in part of
US2003000249843  2003-05-12
     US6910162 issued 2005-06-21   Memory-module burn-in system with removable pattern-generator boards separated from heat chamber by backplane


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