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 Title: |
US7509532:
Robotic memory-module tester using adapter cards for vertically mounting PC motherboards
[ Derwent Title ]
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| Country: |
US United States of America
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| Inventor: |
Co, Ramon S.; Trabuco Canyon, CA, United States of America
Lai, Tat Leung; Torrance, CA, United States of America
Sun, David Da-Wei; Irvine, CA, United States of America
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| Assignee: |
Kingston Technology Corp., Fountain Valley, CA, United States of America
other patents from KINGSTON TECHNOLOGY COMPANY (741845) (approx. 14)
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| Published / Filed: |
2009-03-24
/ 2003-05-12
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| Application Number: |
US2003000249841
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| IPC Code: |
Advanced:
G01R 31/01;
G06F 11/00;
G11C 29/56;
H05K 1/14;
Core:
more...
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| ECLA Code: |
G01R31/01; G11C29/56; T05K1/14B;
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| U.S. Class: |
714/025;
714/027;
714/029;
714/042;
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| Field of Search: |
714/025,27,29,42,24,37,39,41,47,48
711/104
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| Priority Number: |
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| Abstract: |
A test system for testing memory modules uses vertically-mounted personal computer (PC) motherboards. Many test adaptor boards that contain test sockets for testing memory modules are mounted horizontally across a test bench. Each test adaptor board connects to a motherboard that tests the memory modules in the test sockets. The motherboard is mounted below and perpendicularly to the test adaptor board. The motherboard is modified to extend the memory bus to edge contact pads along an edge of the motherboard. An edge socket on the test adaptor board mates with the edge contact pads to make electrical connection. A robotic arm inserts a memory module into the test socket, allowing the vertically-mounted motherboard to execute programs to test the memory module.
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| Attorney, Agent or Firm: |
Auvinen, Stuart T. ;
gPatent LLC ;
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| Primary / Asst. Examiners: |
Beausoliel, Robert; Manoskey, Joseph D
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| INPADOC Legal Status: |
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| Parent Case: |
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part (CIP) of the application for “Local Heating of Memory Modules Tested on a Multi-Motherboard -Tester”, U.S. Ser. No. 09/683,525, filed Jan. 14, 2002, now U.S. Pat. No. 6,742,144, which is a CIP of “Automated Multi-PC-Motherboard Memory-Module Test System with Robotic Handler and In-Transit Visual Inspection”, U.S. Ser. No. 09/660,714, filed Sep. 13, 2000, now U.S. Pat. No. 6,415,397, and “Connector Assembly for Testing Memory Modules from the Solder-Side of a PC Motherboard with Forced Hot Air”, U.S. Ser. No. 09/702,017, filed Oct. 30, 2000, now U.S. Pat. No. 6,357,023.
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| Family: |
Show 11 known family members
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First Claim:
Show all 20 claims |
1. A high-density parallel test system for testing memory modules comprising: a plurality of motherboards, each motherboard being a main board for a computer using memory modules as a memory; test adaptor boards, each coupled to a motherboard in the plurality of motherboards, the test adaptor boards each having a test socket for receiving memory modules for testing by the motherboards, each test adaptor board being a circuit board for electrically connecting a memory module inserted into the test socket to a motherboard attached to the test adaptor board, the motherboard using the memory module inserted into the test socket as a portion of the memory of the motherboard; a plurality of connectors, each connector for electrically connecting one of the test adaptor boards to a motherboard in the plurality of motherboards, wherein the motherboard has a substrate that is substantially perpendicular to the test adaptor board; and a main system interface, coupled to the plurality of motherboards, for commanding the motherboards to test memory modules inserted into a test socket and for receiving test results from the motherboards, whereby the memory modules inserted into the test sockets on the test adaptor boards are tested by motherboards mounted perpendicularly to the test adaptor boards.
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| Background / Summary: |
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| Drawing Descriptions: |
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| Description: |
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| U.S. References: |
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Backward references (24)
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Citation Link
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PDF |
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